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Lead-free solder paste

Product type: SMT solder paste

  • Huateng New Material solder paste is a non cleaning solder paste developed and produced in accordance with IPC, JIS and other international standards. It is made of new rosin resin and composite oxidation resistance technology, spherical solder alloy powder with low oxidation degree and paste environment-friendly flux with strong chemical stability. It is suitable for various precision welding produced by electronic assembly process SMT.


Detail


  • Huateng New Material solder paste has a complete range of types, many alloy models, and a wide range of alloy melting points (138 ℃~287 ℃), which can meet the selection and application of various industries and products.Huateng New Material solder paste is divided into mobile phone solder paste, chip semiconductor packag-ing solder paste, LED solder paste, heat dissipation module low-temperature solder paste, etc.


Product features:


1、 Good printing rolling and leak printing performance, and fine printing can also be completed for pads with
spacing as low as 0.4mm;
2、The continuous printing time is long, there is basically no collapse after several hours of printing, the viscosity
change is small, and the SMD components are not easy to shift;
3、It has excellent welding performance and can complete good wetting in different parts;
4、Good welding performance can still be achieved in a wide range of reflow temperature;
5、There are few residues after welding, the appearance is transparent, the insulation impedance is high, and
PCB will not be corroded, which can meet the requirements of no washing;
6、It has better ICT test performance and will not produce false judgment;
7、It can adapt to the welding of PCB special gold-plated materials without irritating smell.


Lead-free solder paste:

Alloy composition
Melting
point (℃)
Characteristic
Application area
Sn96.5Ag3.0Cu0.5 217-221

Field of application General purpose
products with high silver content,
high welding performance and good
appearance, pin measurement, low
void ratio, excellent mechanical
properties and heat resistance
fatigue performance.


Standard SAC alloy is used for LED chip, chip
solidification, semiconductor packaging,
computer motherboard, precision medical
instruments, mobile phones, tablet computers,
etc. that can withstand high temperature
welding.


Sn98.5Ag1.0Cu0.5 217-226

General purpose product with
medium silver content, high welding
performance, good mechanical
properties and heat resistance
fatigue performance.


Low cost SAC alloy is used for most SMT
applications, such as computer motherboards,
communication equipment boards, home
appliance boards, mobile phones, PPC etc.


Sn99Ag0.3Cu0.7 217-227

General purpose products with low
silver content, good welding
performance, good mechanical
properties and heat resistance
fatigue performance.


Low cost SAC alloy is used for most SMT
applications, such as communication equip
ment boards, home appliance boards, LED
assembly, photovoltaic terminal boxes, etc.


Sn42Bi58 138
Low temperature Sn Bi eutectic
alloy, excellent printability, good
wettability and tin bead resistance,
bright solder spots.

Products or components suitable for low
temperature welding, such as thermistor
welding, LED components, tuner, heat
dissipation module, etc.


Sn42Bi57.6Ag0.4 138-143

At low temperature, silver is added
to improve the vibration drop
property, good wettability and tin
bead resistance of tin bismuth alloy.


Products or components suitable for low
temperature welding, such as thermal sensor
welding, LED components, high frequency
tuner, double side plate through-hole once
reflow process, etc.


Sn64Bi35Ag1.0 139-187

The vibration drop property of Sn Bi
alloy is improved by adding silver
when the Bi content is reduced, but
the temperature is increased, and
the wettability and tin bead
resistance are good.


Products or components suitable for low
temperature welding, such as thermistor, tuner,
remote controller, telephone, LED lamp, etc.


Other alloy grades can be produced according to customer requirements。 






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Shenzhen HuaTeng New Material Co. , Ltd. 


Tel / wechat / whatsapp : +86 13527617289

email: sales@htsolder.com

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