Lead solder paste - Shenzhen HuaTeng New Material Co. , Ltd.

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Lead solder paste

Product type: SMT solder paste

Huateng New Material solder paste is a non cleaning solder paste developed and produced in accordance with IPC, JIS and other international standards. It is made of new rosin resin and composite oxidation resistance technology, spherical solder alloy powder with low oxidation degree and paste environment-friendly flux with strong chemical stability. It is suitable for various precision welding produced by electronic assembly process SMT.

Detail

Huateng New Material solder paste has a complete range of types, many alloy models, and a wide range of alloy melting points (138 ℃~287 ℃), which can meet the selection and application of various industries and products.Huateng New Material solder paste is divided into mobile phone solder paste, chip semiconductor packag-ing solder paste, LED solder paste, heat dissipation module low-temperature solder paste, etc.

Product features:

1、 Good printing rolling and leak printing performance, and fine printing can also be completed for pads with

spacing as low as 0.4mm;

2、The continuous printing time is long, there is basically no collapse after several hours of printing, the viscosity

change is small, and the SMD components are not easy to shift;

3、It has excellent welding performance and can complete good wetting in different parts;

4、Good welding performance can still be achieved in a wide range of reflow temperature;

5、There are few residues after welding, the appearance is transparent, the insulation impedance is high, and

PCB will not be corroded, which can meet the requirements of no washing;

6、It has better ICT test performance and will not produce false judgment;

7、It can adapt to the welding of PCB special gold-plated materials without irritating smell.

Lead solder paste

Alloy composition	Melting point (℃)	Characteristic	Application area
Sn63Pb37	183	Good welding activity and welding reliability, good wettability, long time printing is not easy to dry, low residue, high impedance.	It is applicable to LED chip, communication, IT, security and other electronic products. It is widely used and reliable with low cost.
Sn55Pb45	183-203	Good welding activity and reliability, good wettability and low application cost.	Suitable for LED chip, communication, IT, security and other electronic products.
Sn43Bi14Pb43	144-163	Low temperature, good welding activity and reliability, low applica tion cost. .	Suitable for low cost radiator, thermal element, LED chip and other electronic products.
Sn62.8Pb36.8Ag0.4	178-182	Excellent welding activity and welding reliability, good wettability, excellent auxiliary expansibility.	It is applicable to high-quality LED chip, communication, IT, security and other electronic products.
Sn62Pb36Ag2.0	179	Excellent welding activity and welding reliability, good wettability, excellent auxiliary expansibility.	It is applicable to high-quality LED chip, communication, IT, security and other electronic products.
Sn5Pb92.5Ag2.5	287-296	Specially used for power semicon ductor packaging and welding, the chemical property is stable, and can meet the requirements of long-term dispensing and printing.	Special for semiconductor, meeting the EU high lead exemption standard.

Other alloy grades can be produced according to customer requirements。

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Tel: 0086 13527617289

Mailbox: sales@htsolder.com

URL: http://www.htsolder.com

Address: No.80-3,Donghuan Road,Bao'an district,shenzhen city,China.